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Product	Description	Chip Material	Half Angle (deg)	Wavelength (nm)	Package	Output Power @lf(mA)	Output Power (mW)	Typology	Colour	Resin colour	External Diameter	Max Direct Voltage (V)
Add to comparison	KEDE1304H Kyosemi, Photodevices for Sensors - Emitters, InGaAsP Infrared LED	Chip Material InGaAsP	Half Angle (deg) 80	Wavelength (nm) 1300	Package TO-18, hermetic seal	Output Power @lf(mA) 50	Output Power (mW) 2.5	Typology Infrared LEDs
Add to comparison	KEDE1452H Kyosemi, Photodevices for Sensors - Emitters, InGaAsP Infrared LED	Chip Material InGaAsP	Half Angle (deg) 20	Wavelength (nm) 1450	Package TO-18, hermetic seal	Output Power @lf(mA) 50	Output Power (mW) 2.8	Typology Infrared LEDs
Add to comparison	KEDE1454H Kyosemi, Photodevices for Sensors - Emitters, InGaAsP Infrared LED	Chip Material InGaAsP	Half Angle (deg) 80	Wavelength (nm) 1450	Package TO-18, hermetic seal	Output Power @lf(mA) 50	Output Power (mW) 2.5	Typology Infrared LEDs
Add to comparison	KEDE1552H Kyosemi, Photodevices for Sensors - Emitters, InGaAsP Infrared LED	Chip Material InGaAsP	Half Angle (deg) 20	Wavelength (nm) 1550	Package TO-18, hermetic seal	Output Power @lf(mA) 50	Output Power (mW) 1.8	Typology Infrared LEDs
Add to comparison	KEDE1652H Kyosemi, Photodevices for Sensors - Emitters, InGaAsP Infrared LED	Chip Material InGaAsP	Half Angle (deg) 20	Wavelength (nm) 1650	Package TO-18, hermetic seal	Output Power @lf(mA) 50	Output Power (mW) 2	Typology Infrared LEDs
Discontinued Add to comparison	KEDE1301M51 Kyosemi, Photodevices for Sensors - Emitters, Plastic Mold LEDs for sensors, Infrared color, Kyosemi Photodevices for sensors	Chip Material InGaAsP	Half Angle (deg) 40	Wavelength (nm) 1300	Package M51	Output Power @lf(mA) 50	Output Power (mW) 1.5	Typology Plastic Mold LEDs for Sensors	Colour Infrared	Resin colour Clear	External Diameter ⌀5	Max Direct Voltage (V) 1.3
Discontinued Add to comparison	KEDE1451M52 Kyosemi, Photodevices for Sensors - Emitters, Plastic Mold LEDs for sensors, Infrared color, Kyosemi Photodevices for sensors	Chip Material InGaAsP	Half Angle (deg) 10	Wavelength (nm) 1450	Package M52	Output Power @lf(mA) 50	Output Power (mW) 2.2	Typology Plastic Mold LEDs for Sensors	Colour Infrared	Resin colour Clear	External Diameter ⌀5	Max Direct Voltage (V) 1.3
Discontinued Add to comparison	KEDE1458K Kyosemi, Photodevices for Sensors - Emitters, InGaAsP Infrared LED	Chip Material InGaAsP	Half Angle (deg) 110	Wavelength (nm) 1450	Package TO-46, epoxy lens	Output Power @lf(mA) 50	Output Power (mW) 3	Typology Infrared LEDs
Discontinued Add to comparison	KEDE1551M51 Kyosemi, Photodevices for Sensors - Emitters, Plastic Mold LEDs for sensors, Infrared color, Kyosemi Photodevices for sensors	Chip Material InGaAsP	Half Angle (deg) 40	Wavelength (nm) 1550	Package M51	Output Power @lf(mA) 50	Output Power (mW) 1.6	Typology Plastic Mold LEDs for Sensors	Colour Infrared	Resin colour Clear	External Diameter ⌀5	Max Direct Voltage (V) 1.3
Discontinued Add to comparison	KEDE1651M51 Kyosemi, Photodevices for Sensors - Emitters, Plastic Mold LEDs for sensors, Infrared color, Kyosemi Photodevices for sensors	Chip Material InGaAsP	Half Angle (deg) 40	Wavelength (nm) 1650	Package M51	Output Power @lf(mA) 50	Output Power (mW) 1.6	Typology Plastic Mold LEDs for Sensors	Colour Infrared	Resin colour Clear	External Diameter ⌀5	Max Direct Voltage (V) 1.3